Even though Apple's iPhone 15 Pro and Pro Max models have already impressed with their 1.55 mm thin bezels, the company is looking to push the boundaries even further with the iPhone 16 series through the implementation of "Border Reduction Structure" technology. This approach involves folding the copper wires beneath the display to minimize the lower bezel size.
Previously, Apple employed "low injection pressure over-molding" (LIPO) technology to slim down device bezels. The new technique, as highlighted by sensor expert Revegnus, significantly reduces the space by curving the underlying copper wires. An anonymous industry official mentioned that little to no effort had been previously made to shrink the bottom bezel due to potential overheating issues. However, with smartphone chips becoming thermally more efficient and advancements in cooling solutions, adopting the Border Reduction Structure technology is becoming feasible.
The complexity of embracing this technology implies that it's a complicated process. Reducing the bezels beyond a certain threshold demands additional design and engineering resources, which could have contributed to the cost implications of such a move.
Rumors have suggested that Apple is testing a graphene thermal cooling system for the iPhone 16 series and that the iPhone 16 Pro's battery might be encased in a metal shell for improved heat transfer. These changes in thermal management could pave the way for integrating Border Reduction Structure technology into their phones. It remains unclear whether this technology will be applied across all models or be exclusive to the Pro series.
